Flexible Display

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IPI-H (Flexible OLED substrate)

line Feature

  • Developed for flexible OLED circuit boards with very high pyrolysis temperature and low coefficient of thermal expansion
  • LLO (laser lift-off) possible after completing the OLED TFT process
Item Property
Type High temperature resistance
Glass transition temperature (Tg) > 340℃ (non-thermoplastic)
Pyrolysis temperature (Td) ~ 600℃
Coefficient of thermal expansion
(CTE @ 25~450℃)
< 6 ppm/℃